- 2019
- Extension of frequency up to 20 GHz of near-field probes
- 2018
- Extension of the analog measurement system A300 set with the AS 350 optical sensor with a measuring range of ± 50 V
- 2017
- Development of IC EM pulse injection probe ICI L-EFT set for high precision and very high resolution IC analysis and side channel analysis
- 2015
- Development of the ICT1 IC Tester
- 2015
- Extension of frequency up to 10 GHz of near-field probes
- 2012
- Extension of the analog measurement system with the A300 set with a bandwidth up to 5 MHz
- 2010
- Extension of frequency up to 6 GHz of near-field probes
- 2009
- Company certification as supporter of further education
- 2008
- Launch of ESD-field sources for the IC Test
- 2008
- Development of new ICR near-field microprobes for Langer IC scanner up to 6 GHz with an inner diameter of 100 µm
- 2007
- Launch of the Langer IC scanners with ChipScan-Scanner software
- 2006
- Extension of the analog measurement system with the A200 set with a bandwidth up to 500 kHz
- 2005
- Launch of ICR near-field microprobes with an inner diameter of 150 µm
- 2003
- Introduction of ICE1 IC Test Environment for RF-compliant current and voltage measurements and Burst current and Burst voltage supply in separate pins.
- 2002
- Launch of ESA1 Emission Development System
- 2001
- Research on emitted interference problems of automotive electronics
- 2000
- Production of the first analog measurement system A100 set
- 1998
- Magnetic field sources and E-field sources for Burst generators according to EN 61000-4-4, launch of the first RF near-field probes
- 1997
- Development of the first digital optical measuring systems OSE
- 1996
- Launch of E1 Immunity Development System
- 1994
- Research for technological protection of assemblies against burst disturbance
- 1993
- Start of industry EMC consulting
- 1980
- Basic EMC research (18 patents and utility models / 4 European registrations)
Milestones
Langer EMV-Technik GmbH develops measuring devices for accompanying EMV-analysis during the assembly development (PCB) and IC development (IC)